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AUTO SOLDERING SYSTEM
INDUSTRIAL AUTOMATION AUTO SOLDERING SYSTEM
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SPECIFICATION
- UPM : 50 ~ 100
- Application Device : TSOP Package
- Tray Stack M/Z to Tray Stack M/Z
- 12 Multi Dual Picker : 24PKG One Cycle Procedure / One point Pitch Adjustment Function
- 1St Pick & Place loading to Jig and Gripping & 2nd Solder wick Dipping -> Solder Dipping ->Dry 3RD Un-loading to Jig -> Pick & Place to Tray
- Quick conversion time : within 20 mins
- Smog dust collector
- PLC or PC Control
